How to improve reflow soldering when founding PCB burst
With the development of electronic products in the direction of multi-function, high-density, miniaturization, three-dimensional, etc., a large number of micro-devices are being used more and more, which means that more and more device I/O per unit area, and heating elements will also More and more, the need for heat dissipation is becoming more and more important. At the same time, the thermal stress warping caused by the different CTEs of many materials makes the risk of assembly failure more and more serious, and the probability of early failure of electronic products will increase. The bigger it is.
Therefore, the soldering reliability of PCBA becomes more and more important. The followings are studied by Inspi, and describes the shortage of the blasting plate in reflow soldering and its improvement method for your reference.
1. Explosion phenomenon in reflow soldering
1.1 Definition of the explosion
(1) Definition: In the process of reflow soldering (especially lead-free applications), the separation between the PP layer and the sub-layer (L2) copper foil browning surface of the HDI laminated multilayer PCB occurs. We define it as a burst.
From the slice analysis, the position of the blasting plate occurred in the densely packed area of the L1-L2 layer; no debris or other abnormalities were found; the slice showed that the plate broke out very violently, and some of the second layer lines were cracked.
